Our Technology:

Why use Land Grid Arrays?

LGAs are used to enable high performance, separable electrical connections. They provide excellent signal integrity at high frequencies in fine pitch and low profile applications. Currently, LGA connectors are being used to attach high-end processors, ASICs, and various packaged devices with pin counts up to several thousand I/O. The need for LGA connectors is growing as current socket connectivity becomes obsolete in the demanding trend toward smaller, lighter, higher frequency products.

The SuperButton^®

HCD's patented SuperButton^® contacts consist of several redundant Cu-alloy springs supported in a fully cross-linked polymer 'button'. The mechanical and electrical properties of the SuperButton can be easily engineered to meet specific application requirements. Individual contact elements are arrayed in a variety of material housings, specific to project needs and applications. The SuperButton® technology has low resistance, low inductance, low capacitance, and excellent current carrying capacity for applications up to several GHz and several Amps per I/O.

The SuperSpring^®

HCD's patented SuperSpring^® contacts consist of a dual-metal system; an inner spring designed to give excellent mechanical performance and durability, and an outer layer to provide excellent electrical conductivity. Like the SuperButton^®, mechanical and electrical properties of the SuperSpring® can be easily engineered to meet specific application requirements. Individual contact elements are arrayed in a variety of material housings, specific to project needs and applications. The SuperSpring^® technology is an excellent solution for high-temperature and/or high durability applications.

Applications:

HCD offers the complete solution - from connector design to clamping needs to heat transfer requirements. Our design and electronic packaging experts, coupled with advanced electrical, mechanical, and thermal design tools, enable highly efficient design and simulation of high-speed PCBs and connectors of exceptional performance. Prototypes, engineering samples, and product are manufactured, tested, and packaged at the Sunnyvale, CA facility.

Package-to-Board Attach

Connects packages to the motherboard allowing demountability for prototype, ease of rework, ease of assembly, or field upgrades.

Test and Burn-in Sockets

High durability solution for test and burn-in of PGA, BGA, or LGA packaged devices.

Board-to-Board Connections

Connects mezzanine or perpendicular daughter board to a motherboard or backplane.